TSMC chairman Morris Chang, 16, attended the Stock Exchange, Merrill Lynch and Banc of America Investment Forum jointly organized by Taiwan, said the company in Japan after the 311 earthquake, is the impact of upstream raw materials such as silicon source the problem is not worried In a certain dollar, the Taiwan Semiconductor Manufacturing Company in 2011 compared with 2010 revenue growth of 20% of NTD 4,195.38 million goal has not changed.
As for the 311 earthquake in Japan compared to the possible impact of TSMC, the company should be expansion plans in 2012,glue stick because the internal had a relatively large 2012 expansion plans, but some of the key machine equipment from Japan So TSMC 2012 expansion plan is still no effective follow-up continues, remains to be seen.
16 Chang explained that since the Japanese after the 311 earthquake, the company has assessed the upstream supply of raw materials is no problem, glue gun coupled with TSMC already has another source of silicon wafers and other materials suppliers, so he does not worry about insufficient supply of raw materials that affect the company's Q2 operating performance issues; In contrast, after the earthquake, as long as the source of supply of raw materials in Japan after the resumption, but is expected to gradually stimulate demand, TSMC is still optimistic about the current Q3 2011 Communications and flat market demand for computer products will be better than Q2, related chip demand will continue to grow.
As for the alleged Chang, Japan 311 after the earthquake to be observed whether the progress of the 2012 expansion TSMC affected by the claim, it should be a lot of machine equipment and TSMC sources from Japan TEL (Tokyo Electric), the .
If the earthquake will affect Japan 311 TEL supply planning and progress of the purchase process is TSMC machine may be affected, which is bound to affect a number of TSMC's expansion plans in 2012.
It is understood, TSMC has been related to the internal response plan, if indeed TEL machine equipment will be shipped a considerable extent, is part of TSMC's 65nm process will equipment, first transferred to 40-nanometer process used, because the relevant process equipment is common.